中國·(88805tccn)新蒲京官方正版-The Silk Road

Fully Automatic Wafer Grinding

MFA-0811

Matfron Fully Automatic Wafer Grinding can achieve integrated full-automatic functions of robot loading and unloading, grinding, and cleaning. It has features such as multi-species compatibility, high precision, easy operation and flexible upgradability.

Features

·Support 4, 5, 6, 8 inch wafers

· Dual air spindles for rough and fine grinding

· 3 multi-functional porous ceramic suction cups

· Online thickness monitoring system with 0.1 um accuracy

· Fine grinding roughness < 0.2 um

· Graphical human-computer interaction interface

· Customizable equipment upgrade options

· Support in-line connection with post-grinding Surface Mount System

· Support online MES interconnection