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Fully Automatic Wafer Tapping - Surface

全自动晶圆表面贴膜机

MTS-1211

Matfron Fully Automatic Wafer Tapping-Surface can achieve fully automatic lamination process. It has a wide range of applications and high accuracy, which can reliably protect the circuit on the chip surface during wafer grinding, polishing, dicing, and die bonding processes.

Features

· Support 4, 5, 6, 8, 2 inch wafers

· High precision film cutting

· Self-developed edge finding system

· Broken knife protection function

· MAPPING function

· Relieve film deformation, reduce tension

· Reliable and stable, high efficiency and energy saving

· Convenient operation and easy maintenance

· Support MES online interconnection

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