AOI Solutions
Matfron's AOl inspection technology is primarily applied in the semiconductor packaging field, providing customers with high-precision and efficient solutions for defect inspection and optical measurement.
3D Measurement
Accurate representation in three dimensions
Features
· Bump: height measurement, wafer thickness, flatness, roughness
· Laser Groove: width, depth, offset
· Die Bond: adhesive overflow, silver paste coverage, chip tilt, offset
· Wire Bond: arc height, solder ball height
· Coating: adhesive/translucent gel height
· Laser Mark: character depth
Online Service
Welcome to contact us for more information.
SUPPORT:
TelL：021-66249122 E-mail：service@matfron.com Address: 9F, No.28, Jiang Chang San Road, Jingan, Shanghai
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